Han's Laser Corporation is a wholly-owned subsidiary of Han's Laser Technology Group, a global industrial laser technology leader.
We are committed to providing our customers with the latest industrial laser machine technology to suit their particular needs better.
Headquartered in the U.S., employed by knowledgeable, trained personnel. Han's Laser is transforming the industry with our state-of-the-art machines.
Han's Laser Technology Industry Group Co., Ltd, a public company established in 1996, has become the Chinese national laser industry's flagship and one of the world's most famous laser equipment manufacturers. Han's Laser went public in Shenzhen Stock Exchange Market in 2004. And as of today, its market value reaches more than 7 Billion USD.

Han's Laser has recently launched the "Zhuguang Series" UV nanosecond lasers. This series is based on Han's 15-year UV laser R&D experience and technology accumulation. The characteristics of beam quality and extremely high laser stability have obvious cost-effective advantages, and can be widely used in precision processing fields such as laser marking, cutting and drilling.

Features:

1. The repetition frequency is adjustable, 20kHz-200kHz can be adjusted arbitrarily;

2. Integrated design of optics and control system;

3. TEM 00 mode output

Application scenarios:

1. PCB, FPC board marking, sub-board, cutting and drilling;

2. Solar cell technology;

3. Silicon wafer scribing;

4. Ceramic scribing, cutting and drilling;

5. Remove ink and PVD layer

Integrated UV Laser Specifications1,2

Output Characteristics	JEWEL-3.0-S	JEWEL-5.0-S
Wavelength	355 nm	355 nm
Power^{2, 3}	3W @ 30 kHz，typical	5 W @ 30 kHz，typical
Repetition Rate	10 to 200 kHz	10 to 200 kHz
Pulse Width	<25 nsec @ 30 kHz	<25 nsec @ 30 kHz
Pulse-to-Pulse Energy Stability(RMS 1σ)	<3% rms @ 30 kHz,typical	<3% rms @ 30 kHz,typical
Beam Characteristics
Spatial Mode	TEM₀₀	TEM₀₀
M²	<1.2	<1.2
Polarization Ratio	100:1 Horizonal	100:1 Horizonal
Beam Diameter,	1.1 mm ±0.1mm（500mm from exit window）	1.1mm ±0.1mm（500mm from exit window）
Beam Divergence (full angle)	<2 mrad	<2 mrad
Beam Asymmetry (circularity)	>90%	>90%
Beam Pointing Stability⁴	< ±25 µrad/°C	< ±25 µrad/°C
Operating Conditions / Environmental Range
AC Input	100 to 240VAC auto ranging,50 to 60Hz auto ranging
Warm-up Time	<10 min from standby; <30 minutes from cold start
Temperature Range	18 to 35°C operating; 0 to 50°C non-operating
Humidity	10–90%, non-condensing
Water Cooling Requirements	25°C ±1°C, stable to ±0.5°C, 6 liter/minute typical
Thermal Load (to water)	<300 W
Total Power Consumption	<1000 W
Physical Characteristics
Dimensions (Laser) (L × W × H)	370 x 165 x 132 mm
Weight (Laser)	10 kg

Laser head Dimensions (mm)

1. Due to our continuous product improvement, all specifications are subject to change without notice.
2. All specifications, except power, are at 30 kHz, unless otherwise noted.
3. Power specification and warranty is at 30 kHz, except where identified as “typical”. Other values are for reference.
4. Pointing stability applies after 2 hour warm-up.

Features：

The UV laser marking machine uses a 355 nm wavelength UV laser with a "cold marking" method. The laser beam diameter is only 20 μm after focusing. The UV laser's pulse energy comes in contact with the material in the microsecond, and there is no significant thermal influence next to the slit, so no heat damages the electronic component.

- With cold laser processing and a small heat-affected zone, it can achieve high-quality processing

- Wide applicable materials range can compensate for the shortage of the infrared laser processing ability

- With good beam quality and a small focusing spot, it can achieve superfine marking

- High marking speed, high efficiency, and high precision

- No consumables, low cost, and low maintenance fee

- The overall machine has stable performance and supporting the long-term operation
- The double-station rotary table supports simultaneous work of loading and unloading and laser processing.

Application and Samples：

- UV laser marking of electronic products' LOGO, model, place of origin

- UV laser marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm

- PCB laser marking, PCB laser depaneling, PCB laser singulation

- Removal of metal or non-metallic coatings

- Silicon wafer micro-hole and blind hole laser processing

- Laser marking of low-voltage apparatus and refractory materials