Maxphotonics HMB multi-wavelength compound laser is here for subversion!

Maxphotonics continues to innovate on the road of laser technology development, and once again launched a subversive new product - HMB multi-wavelength compound laser.

The HMB multi-wavelength compound laser can provide a total output power of 8000W, and can flexibly adjust the output beam mode parameters. The diameter of the core beam output fiber is 35μm/50μm, and the output power can reach 4000W. The diameter of the peripheral beam output fiber is 300μm-500μm, and the output power can reach 4000W.

When the HMB laser is used for welding, the core beam can achieve deep penetration welding, and the peripheral beam can make the temperature gradient around the keyhole more gentle, and the keyhole is more stable during welding, thereby effectively improving the welding quality and efficiency, and can weld a wider range of materials type to reduce spatter.

Processing advantages of compound light：

1. Increase the width and depth of the weld;

2. Improve the forming quality of the weld surface, smoother and finer;

3. For stainless steel, the composite spot can significantly reduce the weld height and make the weld surface smoother;

4. By adjusting the output power of the core beam and peripheral beam, it helps to reduce or even remove welding spatter;

5. The ring beam helps to improve the absorption rate of the material, and a small central beam energy density can form a welding keyhole, which has a significant effect on reducing the adhesion of welding slag on the surface of the material.

Product advantages：

1. 1080nm, 975nm, 915nm multi-wavelength optical path;

2. 1000W～8000W total power output;

3. A variety of power specifications are available, higher conversion efficiency, and better cost-effective options;

4. Multi-wavelength single optical cable standard QBH output;

5. Multi-wavelength power 10%～100% continuously and independently adjustable;

6. Diversified customization of inner and outer fiber core diameters to meet different application requirements;

7. Good compatibility, suitable for existing processing systems.