This precision laser cutting system is engineered specifically for ultra-thin metal sheet processing, especially 0.060mm stainless steel. With its high-speed fiber laser source, micron-level motion control, and CCD visual alignment system, the machine delivers clean, accurate, and burr-free results for micro-feature components.
SMT stencils and solder paste masks
Micro-perforated metal filters and screens
Electronic and communication components
Medical precision parts and sensor housings
Microfluidic channels and aerospace foil parts
The machine provides stable repeatability (±2μm), auto hole correction, and non-contact cutting, ensuring that even delicate 0.060mm stainless steel sheets are processed with minimal thermal distortion or mechanical stress.
| Parameter | Specification |
|---|---|
| Model | SC-G6060 |
| Laser Type | Fiber Laser (IPG) 100W–200W |
| Wavelength | 1070 nm |
| Beam Quality | M⊃2; < 1.1 |
| Cutting Thickness Range | 0.03 mm – 1.0 mm |
| Optimal Processing Thickness | 0.050mm–0.060mm (Stainless Steel) |
| Cutting Accuracy | ±5 μm |
| Repeatability | ±2 μm |
| Cutting Line Width | 0.02 – 0.03 mm |
| Positioning Accuracy | ±2 μm |
| CCD Positioning Accuracy | 0.01 mm |
| Cutting Speed | Up to 22,000 holes/hour |
| Working Area | 650 mm × 650 mm |
| Max Clamping Size | 680 mm × 720 mm |
| Motion Platform | Natural Granite Base |
| Z-Axis Accuracy | < 0.01 mm |
| Main Drive Components | Panasonic, Copley, Renishaw |
| Controller | Radium Tech + HKStudio software |
| Supported File Formats | LMC, LMD, CNC, DXF, STC, TCM |
| Auxiliary Gases | Industrial Oxygen (8–10 Kg), Air (16 Kg) |
| Power Supply | 220V, 3KW |
| Overall Dimensions | 1640mm × 1380mm × 1500mm |
| Equipment Weight | Approx. 2200 Kg |
Superior Flatness & Stability thanks to granite base and closed-loop control
Fast Prototyping & Batch Production with high throughput
No Material Deformation with non-contact precision laser cutting
Ideal for Complex Geometries in electronics, medical, and aerospace industries
Auto Hole Patch + CCD ensures micron-level alignment and accuracy
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