We provide precision laser cutting services specifically designed for Micro-LED shadow masks, delivering exceptional accuracy, consistency, and edge quality to meet the critical demands of next-generation display technologies.

Our capabilities include:

Micro-Precision Cutting: Fine features down to micron-level tolerances, essential for ultra-high pixel density Micro-LED applications.
Burr-Free and Clean Edges: Minimizing defects to ensure high-efficiency material deposition.
Stress-Free Processing: Maintaining excellent flatness and dimensional stability without warping or heat-induced distortion.
Material Handling Expertise: Specializing in ultra-thin metals such as Invar, SUS304, Nickel, and other high-performance alloys.
High Aperture Accuracy: Delivering uniform micro hole arrays and fine slot geometries with tolerance control up to ±3–5μm.
Custom Designs: Supporting complex geometries required for RGB Micro-LED array transfer and alignment processes.

Applications:

Micro-LED display fabrication
High-resolution and large-area Micro-LED panel production
Advanced pixel transfer shadow mask manufacturing
Wafer-to-wafer Micro-LED integration systems

With our state-of-the-art laser technology and rigorous quality control, we help customers achieve high yield, superior precision, and optimized production efficiency for Micro-LED display development.